微服务打包异常：Error response from daemon: Error processing tar file(exit status 1): write /spa-icd_backend.zip: no space left on device
环境：华为云测试区租户名称：电子半导体事业部
租户编号：icd
问题描述：
微服务打包异常，请协助排查服务器情况。具体异常日志如下：>>> Execute Command: make appPackageName=spa-icd_backend imageName=spa-icdbackend-5.2.0 imageTag=1.0.0.1218 repoUrl=registry.digiwincloud.com.cn repoProjectName=icd
Start building docker image -> registry.digiwincloud.com.cn/icd/spa-icdbackend-5.2.0:1.0.0.1218
docker build -t registry.digiwincloud.com.cn/icd/spa-icdbackend-5.2.0:1.0.0.1218 --build-arg appPackageName=spa-icd_backend .
Sending build context to Docker daemon316.7MB
Error response from daemon: Error processing tar file(exit status 1): write /spa-icd_backend.zip: no space left on device
make: *** Error 1
<<< Complete Time: 2026-01-19T11:08:44.613122504
<<< Total Time: 24 s镜像管理中排查还有空间：
此问题是由于测试区服务器磁盘满了，导致不能写入，目前已经找运维清理磁盘空间了，已修复。
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